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XTAI
8131
Market cap1.05bUSD
Jul 09, Last price  
76.00TWD
1D
1.33%
1Q
25.00%
Jan 2017
222.72%
IPO
40.74%
Name

Formosa Advanced Technologies Co Ltd

Chart & Performance

D1W1MN
XTAI:8131 chart
P/E
55.77
P/S
3.39
EPS
1.36
Div Yield, %
1.91%
Shrs. gr., 5y
-0.04%
Rev. gr., 5y
0.44%
Revenues
9.92b
+11.07%
6,433,416,0008,910,462,00010,177,230,0008,956,145,00011,819,772,00011,860,894,00010,653,513,0008,667,155,0009,204,384,0008,760,789,0008,491,396,0007,888,494,0008,785,525,0009,457,849,0009,706,776,0009,939,192,00010,433,443,0007,648,594,0008,932,564,0009,921,208,000
Net income
603m
-33.07%
1,203,753,0001,732,924,0001,014,244,00073,732,0001,528,022,0001,189,927,000292,325,000116,936,000843,644,0001,127,081,0001,022,556,0001,393,086,0001,420,293,0001,262,496,0001,402,677,0001,557,008,0002,055,289,000530,215,000900,345,000602,632,000
CFO
427m
-75.52%
1,997,623,0002,536,176,0002,888,965,0001,986,258,0004,281,312,0004,850,359,0004,032,537,0002,852,637,0002,012,812,0003,177,633,0002,642,071,0002,358,444,0002,266,218,0002,322,715,0003,098,229,0002,983,136,0003,335,939,0001,846,790,0001,746,143,000427,494,000
Dividend
Jul 22, 20251.45 TWD/sh

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Profile

Formosa Advanced Technologies Co., Ltd., established in 1990 and headquartered in Douliou City, Taiwan, specializes in a wide array of semiconductor and optoelectronic services. The company's primary offerings encompass comprehensive wafer probing, integrated circuit (IC) assembly and testing, and complete module turnkey solutions within Taiwan. For IC packaging, they develop solutions tailored for numerous portable electronic devices, including mobile phones, various memory modules, PC cards, personal digital assistants (PDAs), disc drives, and telephone handsets. Their product range in this category also features DIMM products specifically for laptops and diverse flash cards. In the LED sector, Formosa Advanced Technologies produces components such as PLCC, EMC, and UV LED products. Additionally, they provide essential back-end services for LED chips, which include grinding, dicing, probing, sorting, and PI services. Beyond manufacturing, their robust testing capabilities cover wafer probe, burn-in, and final testing for memory, logical, and mixed-signal semiconductors. This is supported by additional services like testing program validation, tester/fixture correlation, engineering lot support, production lot verification, and periodic reporting. Furthermore, the company delivers extensive module services, offering everything from customized product development to OEM and ODM solutions. This includes the supply of blank DRAM modules, specifically U-DIMM, SO-DIMM, R-DIMM, and FB-DIMM types.
IPO date
Nov 28, 2006
Employees
Domiciled in
TW
Incorporated in
TW

Valuation

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