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XTAI
2344
Market cap24bUSD
Sep 17, Last price  
170.00TWD
1D
0.59%
1Q
-22.20%
Jan 2017
1,632.93%
Name

Winbond Electronics Corp

Chart & performance

D1W1MN
XTAI:2344 chart
P/E
193.09
P/S
8.56
EPS
0.88
Div yield, %
Shrs. gr., 5y
2.31%
Rev. gr., 5y
8.06%
Revenues
89.41b
+9.55%
35,476,591,00032,898,590,00025,645,153,00026,695,369,00039,934,358,00034,696,850,00032,965,283,00033,135,448,00037,989,660,00038,350,315,00042,091,709,00047,591,792,00051,190,323,00048,771,434,00060,683,171,00099,569,924,00094,529,790,00075,006,078,00081,609,768,00089,406,171,000
Net income
3.96b
+559.22%
2,364,370,000-5,812,147,000-7,364,903,000-8,612,939,0003,550,996,000-843,291,000-1,852,536,000206,564,0003,075,969,0003,291,251,0002,897,791,0005,550,562,0007,446,496,0001,256,387,0001,304,019,00013,594,643,00012,927,165,000-1,146,522,000601,001,0003,961,929,000
CFO
11.18b
+0.51%
8,204,033,0009,933,895,0002,038,024,0005,249,181,00011,610,779,0009,608,138,0006,354,362,0007,257,601,0009,135,205,0007,658,106,0009,991,424,00012,143,274,00013,533,242,00010,575,896,00011,117,887,00030,375,384,00015,696,152,0003,601,473,00011,125,880,00011,182,762,000
Dividend
Mar 27, 20260.5 TWD/sh

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Profile

Winbond Electronics Corporation is a global enterprise specializing in the entire lifecycle of very large scale integration (VLSI) integrated circuits (ICs). This encompasses the design, development, manufacturing, and worldwide distribution of these components for a broad spectrum of microelectronic applications across Asia, the Americas, and Europe. The company organizes its operations into three primary product divisions: DRAM IC, Flash Memory, and Logic IC products. Its extensive portfolio features a diverse range of Dynamic Random-Access Memory (DRAM) devices. For mobile uses, these include pseudo static RAM (SRAM), HyperRAM, various low-power synchronous DRAM (SDR SDRAM), and double-data-rate (DDR) SDRAM standards (such as DDR1, DDR2, DDR3, and DDR4/4X), along with Known Good Die (KGD) formats. Furthermore, Winbond offers specialty DRAM units like standard SDRAM, DDR, DDR2, and DDR3 SDRAM, also available as KGD. In the realm of flash memory, the company provides solutions specifically for code storage, which consist of serial NOR flash, QspiNAND Flash, Single-Level Cell (SLC) NAND Flash, NAND-Based Multi-Chip Packages (MCP), SpiStack Flash NAND, and TrustME secure flash memory. Additionally, Winbond supplies a selection of logic integrated circuits. These sophisticated semiconductor components are integral to numerous high-technology sectors. Their widespread applications span computing, telecommunications, and general consumer electronics, extending to critical automotive and industrial control systems. They are also crucial for contemporary personal devices like smartphones, tablets, low-power mobile handhelds, and wearable technology, as well as the burgeoning Internet of Things (IoT). Further uses include powering personal computers and their associated peripherals, modules for mobile handheld devices, network communication equipment, and household appliance control units. Winbond markets its products through an established network of distributors and directly via online channels. Beyond its core manufacturing and sales, the company is deeply involved in comprehensive research, development, and design activities, providing dedicated post-sales support for its semiconductor and 6-inch wafer products. The corporation also operates in e-commerce, offers specialized testing services, serves as an Original Equipment Manufacturer (OEM), provides computer software services, and delivers expert consulting. Moreover, it includes a wholesale division for computer hardware, accessories, and software, in addition to handling project-specific sales. Established in 1987, Winbond Electronics Corporation maintains its principal corporate office in Taichung, Taiwan.

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Subsidiaries

Key people

Chairman of the Board, Chief Executive Officer · since 2005
Vice Chairman of the Board, Deputy Chief Executive Officer · since 2017
Tung-Yi Chan
General Manager · since 2017
Deputy General Manager · since 2005
Chiou-Jii Huang
Deputy General Manager-Finance Center, Head of Finance · since 2020
Cheng-Kung Lin
Deputy General Manager · since 2006
Deputy General Manager · since 2014
Eung Joon Park
Chief Business Officer · since 2008
Director · since 2014
Wei-Hsin Ma
Director · since 2017
Sophi Pan
Director · since 2017
Independent Director · since 2014
Independent Director · since 2014
Independent Director · since 2014
Independent Director · since 2019
IPO date
Oct 18, 1995
Employees
Domiciled in
TW
Incorporated in
TW
Headquarters & legal address
No. 8
Keya 1st Road
Daya Dist.
Taichung City, TXG 428303
TW

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