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XTAI
2344
Market cap22bUSD
Oct 30, Last price  
164.50TWD
1D
-3.52%
1Q
26.54%
Jan 2017
1,576.86%
Name

Winbond Electronics Corp

Chart & performance

D1W1MN
XTAI:2344 chart
P/E
186.84
P/S
8.28
EPS
0.88
Vol. 1Y
84.23%
Shs. 5Y
2.31%
Rev. 5Y
8.06%
Div Yld LY
—
Div Yld TTM
0.30%
Revenues
89.41b
+9.55%
35,476,591,00032,898,590,00025,645,153,00026,695,369,00039,934,358,00034,696,850,00032,965,283,00033,135,448,00037,989,660,00038,350,315,00042,091,709,00047,591,792,00051,190,323,00048,771,434,00060,683,171,00099,569,924,00094,529,790,00075,006,078,00081,609,768,00089,406,171,000
Net income
3.96b
+559.22%
2,364,370,000-5,812,147,000-7,364,903,000-8,612,939,0003,550,996,000-843,291,000-1,852,536,000206,564,0003,075,969,0003,291,251,0002,897,791,0005,550,562,0007,446,496,0001,256,387,0001,304,019,00013,594,643,00012,927,165,000-1,146,522,000601,001,0003,961,929,000
CFO
11.18b
+0.51%
8,204,033,0009,933,895,0002,038,024,0005,249,181,00011,610,779,0009,608,138,0006,354,362,0007,257,601,0009,135,205,0007,658,106,0009,991,424,00012,143,274,00013,533,242,00010,575,896,00011,117,887,00030,375,384,00015,696,152,0003,601,473,00011,125,880,00011,182,762,000
Dividend
Mar 27, 20260.5 TWD/sh

Notes

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Profile

Winbond Electronics Corporation is a global enterprise specializing in the entire lifecycle of very large scale integration (VLSI) integrated circuits (ICs). This encompasses the design, development, manufacturing, and worldwide distribution of these components for a broad spectrum of microelectronic applications across Asia, the Americas, and Europe. The company organizes its operations into three primary product divisions: DRAM IC, Flash Memory, and Logic IC products. Its extensive portfolio features a diverse range of Dynamic Random-Access Memory (DRAM) devices. For mobile uses, these include pseudo static RAM (SRAM), HyperRAM, various low-power synchronous DRAM (SDR SDRAM), and double-data-rate (DDR) SDRAM standards (such as DDR1, DDR2, DDR3, and DDR4/4X), along with Known Good Die (KGD) formats. Furthermore, Winbond offers specialty DRAM units like standard SDRAM, DDR, DDR2, and DDR3 SDRAM, also available as KGD. In the realm of flash memory, the company provides solutions specifically for code storage, which consist of serial NOR flash, QspiNAND Flash, Single-Level Cell (SLC) NAND Flash, NAND-Based Multi-Chip Packages (MCP), SpiStack Flash NAND, and TrustME secure flash memory. Additionally, Winbond supplies a selection of logic integrated circuits. These sophisticated semiconductor components are integral to numerous high-technology sectors. Their widespread applications span computing, telecommunications, and general consumer electronics, extending to critical automotive and industrial control systems. They are also crucial for contemporary personal devices like smartphones, tablets, low-power mobile handhelds, and wearable technology, as well as the burgeoning Internet of Things (IoT). Further uses include powering personal computers and their associated peripherals, modules for mobile handheld devices, network communication equipment, and household appliance control units. Winbond markets its products through an established network of distributors and directly via online channels. Beyond its core manufacturing and sales, the company is deeply involved in comprehensive research, development, and design activities, providing dedicated post-sales support for its semiconductor and 6-inch wafer products. The corporation also operates in e-commerce, offers specialized testing services, serves as an Original Equipment Manufacturer (OEM), provides computer software services, and delivers expert consulting. Moreover, it includes a wholesale division for computer hardware, accessories, and software, in addition to handling project-specific sales. Established in 1987, Winbond Electronics Corporation maintains its principal corporate office in Taichung, Taiwan.

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Subsidiaries

Key people

Chairman of the Board, Chief Executive Officer · since 2005
Chih-Chung Chou
Chief Financial Officer · since 2025
Chief Technology Officer-Advanced Technology Development Group · since 2024
Ming-Yi Tsai
Chief Information Officer · since 2023
Pei-Ming Chen
General Manager · since 2020
Executive Deputy General Manager, General Manager-Group Empowers Group, Head of Finance · since 2025
Wen-Chang Hung
Deputy General Manager-Sales Center · since 2024
Deputy General Manager · since 2022
Wen-Hua Lu
Deputy General Manager · since 2019
Jing-Fong Tsai
Deputy General Manager-Quality and ESH Center · since 2024
Eung Joon Park
Chief Strategy Officer · since 2022
Liang-Wen Shen
Corporate Governance Officer · since 2025
Shuibao Wu
Chief Information Security Officer · since 2022
Chin-Feng Yang
Head of Accounting · since 2020
Shih Lan Chang
Director · since 2023
Yung Chin
Director · since 2020
Chih-Chen Lin
Director · since 2017
Wei-Hsin Ma
Director · since 2017
Wen-Hu Pan
Director · since 2020
Independent Director · since 2014
IPO date
Oct 18, 1995
Employees
Domiciled in
TW
Incorporated in
TW
Headquarters & legal address
No. 8
Keya 1st Road
Daya Dist.
Taichung City, TXG 428303
TW

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