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ROCO
6261
Market cap244mUSD
Nov 13, Last price  
59.60TWD
Name

Youngtek Electronics Corp

Chart & Performance

D1W1MN
ROCO:6261 chart
P/E
14.67
P/S
1.93
EPS
4.06
Div Yield, %
6.71%
Shrs. gr., 5y
-0.05%
Rev. gr., 5y
4.18%
Revenues
3.97b
+6.90%
1,637,594,0001,847,077,0002,054,612,0001,985,156,0003,100,141,0003,053,745,0003,706,080,0003,651,244,0004,091,118,0003,715,418,0003,615,951,0003,670,383,0003,490,642,0003,232,841,0003,503,969,0005,221,420,0004,600,042,0003,710,751,0003,966,808,000
Net income
522m
-0.76%
585,634,000616,610,000560,287,000381,286,000819,807,000692,210,000616,098,000496,530,000730,887,000476,555,000443,072,000515,617,000460,582,000402,544,000529,542,0001,080,084,000854,180,000526,019,000522,018,000
CFO
715m
+37.65%
322,335,000940,770,000617,091,000854,796,0001,205,724,000550,544,0001,586,052,000983,091,0001,046,416,000886,748,0001,039,085,000941,669,000791,509,0001,289,489,000545,278,0001,158,634,0001,299,861,000519,253,000714,754,000
Dividend
Aug 28, 20244 TWD/sh

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Profile

Youngtek Electronics Corporation offers semiconductor back-end foundry services in Taiwan. The company engages in wafer testing, wafer grinding and cutting and die picking, IC product testing, special substrate cutting, test program development, platform conversion, engineering support, and valet shipping; and AOI automatic optical inspection of LED dies and VCSEL components, die picking inspection, visual inspection, and other back-end process foundry activities. It also provides OEM services, including gluing, die bonding, hot pressing, testing, and compounding. In addition, the company offers IC sorting and bonding; WLCSP die sorting packaging; label flip-chip binding; and die and LED bonding machines. Youngtek Electronics Corporation was founded in 1991 and is headquartered in Hsinchu City, Taiwan.
IPO date
Nov 29, 2002
Employees
Domiciled in
TW
Incorporated in
TW

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