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XTAI3189
Market cap1.42bUSD
Dec 24, Last price  
101.50TWD
1D
0.50%
1Q
-4.69%
Jan 2017
42.56%
Name

Kinsus Interconnect Technology Corp

Chart & Performance

D1W1MN
XTAI:3189 chart
P/E
975.48
P/S
1.73
EPS
0.10
Div Yield, %
7.42%
Shrs. gr., 5y
0.23%
Rev. gr., 5y
2.49%
Revenues
26.83b
-35.54%
11,913,774,00012,989,017,00012,214,983,00011,082,951,00017,594,845,00022,752,436,00022,034,283,00023,102,827,00024,943,834,00023,061,311,00023,165,066,00022,335,486,00023,727,929,00022,327,410,00027,098,474,00035,672,763,00041,626,486,00026,832,187,000
Net income
48m
-99.32%
3,919,861,0003,867,757,0002,198,380,0001,919,151,0002,452,539,0002,798,653,0002,797,694,0003,224,093,0003,617,327,0002,903,952,0002,233,705,000491,676,000349,485,000-1,947,268,000929,443,0003,858,984,0006,976,792,00047,516,000
CFO
6.26b
-60.80%
4,108,546,0005,140,264,0004,696,548,0001,440,332,0002,430,810,0003,662,799,0005,427,929,0006,077,233,0006,887,088,0006,938,575,0005,752,676,0006,002,634,0004,102,579,0003,101,309,0005,358,469,00010,574,431,00015,960,956,0006,256,067,000
Dividend
Jul 04, 20241.00011 TWD/sh
Earnings
Jan 27, 2025

Profile

Kinsus Interconnect Technology Corp. manufactures and sells electronic products in Taiwan and internationally. It operates through three segments: IC Substrate, Printed Circuit Board (PCB), and Optics. The company offers system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for modules in handset and wearable devices; plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. It also provides wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and WiFi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company provides PCBs and related products, and electronic parts and components, as well as after sales services. Further, it is involved in the wholesale and retail-sale of electronic materials; manufacture and sale of medical equipment; provision of consultation services for business operation and management; investment and trading activities; and sale of cosmetic products. Additionally, the company produces, manufactures, and sells contact lens. It primarily serves manufacturers of electronic products. Kinsus Interconnect Technology Corp. was incorporated in 2000 and is headquartered in Taoyuan City, Taiwan.
IPO date
Sep 01, 2003
Employees
Domiciled in
TW
Incorporated in
TW

Valuation

Title
TWD in thousands, except ratios and share amounts
FYFYFYFYFYFYFYFYFYFY
2023‑122022‑122021‑122020‑122019‑122018‑122017‑122016‑122015‑122014‑12
Income
Revenues
26,832,187
-35.54%
41,626,486
16.69%
35,672,763
31.64%
Cost of revenue
25,772,400
31,657,362
30,661,362
Unusual Expense (Income)
NOPBT
1,059,787
9,969,124
5,011,401
NOPBT Margin
3.95%
23.95%
14.05%
Operating Taxes
255,683
2,158,404
671,803
Tax Rate
24.13%
21.65%
13.41%
NOPAT
804,104
7,810,720
4,339,598
Net income
47,516
-99.32%
6,976,792
80.79%
3,858,984
315.19%
Dividends
(3,438,175)
(2,443,311)
(450,847)
Dividend yield
7.60%
5.05%
0.43%
Proceeds from repurchase of equity
147,917
165,379
BB yield
-0.33%
-0.34%
Debt
Debt current
3,339,317
533,203
1,180,878
Long-term debt
15,693,664
11,364,481
9,657,883
Deferred revenue
3,912,317
2,441,184
55,289
Other long-term liabilities
5,251,009
4,964,134
1,836,666
Net debt
2,842,896
(5,218,637)
(4,869,271)
Cash flow
Cash from operating activities
6,256,067
15,960,956
10,574,431
CAPEX
(10,360,791)
(17,177,738)
(13,431,362)
Cash from investing activities
(12,486,482)
(16,534,731)
(12,895,057)
Cash from financing activities
5,335,272
1,869,946
5,999,519
FCF
(3,145,553)
(4,657,798)
(8,705,623)
Balance
Cash
21,013,417
17,922,806
15,968,164
Long term investments
(4,823,332)
(806,485)
(260,132)
Excess cash
14,848,476
15,034,997
13,924,394
Stockholders' equity
27,278,778
32,162,149
26,415,343
Invested Capital
52,233,637
40,793,589
30,879,846
ROIC
1.73%
21.80%
15.86%
ROCE
1.58%
17.84%
11.18%
EV
Common stock shares outstanding
453,662
462,836
453,217
Price
99.70
-4.59%
104.50
-55.15%
233.00
188.01%
Market cap
45,230,101
-6.48%
48,366,362
-54.20%
105,599,561
189.21%
EV
55,537,234
47,641,918
104,650,056
EBITDA
6,411,240
15,076,202
9,388,813
EV/EBITDA
8.66
3.16
11.15
Interest
331,807
146,531
81,133
Interest/NOPBT
31.31%
1.47%
1.62%