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XSES
5DD
Market cap300mUSD
Jul 10, Last price  
2.82SGD
1D
1.08%
1Q
5.62%
Jan 2017
226.01%
IPO
781.25%
Name

Micro-Mechanics (Holdings) Ltd

Chart & Performance

D1W1MN
XSES:5DD chart
P/E
31.62
P/S
6.01
EPS
0.09
Div Yield, %
2.15%
Shrs. gr., 5y
Rev. gr., 5y
0.31%
Revenues
65m
+12.65%
31,702,17634,695,60838,205,95533,143,17640,959,40245,308,15338,793,10239,153,40143,856,66352,197,04651,251,04257,229,66565,101,85860,330,94664,207,75073,728,70282,464,76567,021,99357,888,37865,210,675
Net income
12m
+54.21%
7,731,9268,301,7598,858,792540,1614,775,0266,825,9014,220,6785,124,7467,740,24612,021,24911,883,40914,762,21717,143,51412,948,70514,650,04318,060,43619,806,5519,770,4808,038,11612,395,468
CFO
18m
+25.40%
10,667,75811,819,27510,600,3734,134,4438,651,2088,699,4728,927,3258,831,13410,839,34814,147,98416,312,03318,095,12822,414,21919,266,91218,796,40925,701,46025,222,34117,699,77814,577,88018,280,911
Dividend
Nov 06, 20250.03 SGD/sh

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Profile

Established in Singapore in 1983, Micro-Mechanics (Holdings) Ltd. is a specialist in the engineering, manufacturing, and global distribution of high-precision parts and tools. These crucial components are essential for the wafer fabrication and assembly stages within the semiconductor industry. The company's operations span five distinct geographical segments: Singapore, Malaysia, the Philippines, the USA, and China. Micro-Mechanics offers a comprehensive array of products designed for various semiconductor production processes. Its solutions for die attach applications encompass pick-up tools, such as rubber tips, high-temperature plastic, and tungsten carbide instruments, along with sensor and vacuum wand assemblies. For dispensing operations, it provides products like nozzle adaptors, specialized nozzles, pen dispense systems, and epoxy stamping tools. The company also supplies critical die ejection essentials, including ejector needles, holders, and seals. Furthermore, Micro-Mechanics delivers thermosonic bonding products, such as clamps and electronic flame-off units, alongside ultrasonic bonding equipment that includes clamps, bearing base assemblies, anvils, and wire cutters. Its encapsulation product line features BGA dispensing nozzles, manifolds, pump screws, and O-rings. In addition to its standard offerings, the company undertakes contract manufacturing, fabricating custom precision parts and assemblies for original equipment manufacturers (OEMs).
IPO date
Jun 25, 2003
Employees
495
Domiciled in
SG
Incorporated in
SG

Valuation

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2025‑062024‑062023‑062022‑062021‑062020‑062019‑062018‑062017‑06
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