Loading...
XNYS
ASX
Market cap22bUSD
Jul 14, Last price  
10.20USD
1D
-2.02%
1Q
21.00%
Jan 2017
102.38%
IPO
84.78%
Name

ASE Technology Holding Co Ltd

Chart & Performance

D1W1MN
XNYS:ASX chart
No data to show
P/E
40.11
P/S
2.18
EPS
7.45
Div Yield, %
0.10%
Shrs. gr., 5y
0.60%
Rev. gr., 5y
7.58%
Revenues
595.41b
+2.32%
84,253,573,295100,408,141,182101,168,479,08294,431,000,00085,775,000,000188,742,797,000185,347,206,000193,972,000,000219,862,000,000256,591,000,000283,302,000,000274,884,000,000290,441,000,000371,092,000,000413,182,000,000476,978,000,000569,997,000,000670,873,000,000581,914,471,000595,409,585,000
Net income
32.38b
+2.06%
-4,703,344,24017,413,473,13712,165,887,8526,160,000,0006,744,000,00018,337,500,00013,725,958,00013,091,000,00016,296,000,00023,593,000,00019,051,000,00021,692,000,00022,988,000,00025,262,000,00017,060,591,00026,970,580,00060,150,167,00061,501,545,00031,725,403,00032,378,936,000
CFO
90.79b
-20.66%
20,503,994,81037,288,838,51428,308,294,98430,728,799,00015,517,228,00036,965,094,00031,936,706,00029,017,945,00041,295,955,00045,863,477,00057,548,305,00052,107,867,00047,430,800,00050,760,000,00072,303,000,00075,074,000,00081,686,000,000110,984,000,000114,421,849,00090,787,754,000
Dividend
Jul 02, 20240.00994143 USD/sh
Earnings
Jul 23, 2025

Profile

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
IPO date
Apr 30, 2018
Employees
93,950
Domiciled in
TW
Incorporated in
TW

Valuation

Title
TWD in thousands, except ratios and share amounts
FYFYFYFYFYFYFYFYFYFY
2024‑122023‑122022‑122021‑122020‑122019‑122018‑122017‑122016‑122015‑12
Income
Revenues
595,409,585
2.32%
581,914,471
-13.26%
670,873,000
17.70%
Cost of revenue
556,243,200
541,586,764
590,697,522
Unusual Expense (Income)
NOPBT
39,166,385
40,327,707
80,175,478
NOPBT Margin
6.58%
6.93%
11.95%
Operating Taxes
7,916,463
9,042,952
16,399,000
Tax Rate
20.21%
22.42%
20.45%
NOPAT
31,249,922
31,284,755
63,776,478
Net income
32,378,936
2.06%
31,725,403
-48.42%
61,501,545
2.25%
Dividends
(22,459,417)
(37,840,609)
(29,990,842)
Dividend yield
3.16%
6.45%
7.39%
Proceeds from repurchase of equity
1,175,260
863,647
BB yield
-0.20%
-0.21%
Debt
Debt current
54,858,129
35,789,095
56,772,000
Long-term debt
154,365,937
117,235,655
145,507,487
Deferred revenue
Other long-term liabilities
10,961,422
17,103,586
18,497,868
Net debt
81,838,445
57,521,677
113,770,487
Cash flow
Cash from operating activities
90,787,754
114,421,849
110,984,000
CAPEX
(80,115,434)
(54,158,229)
(71,890,000)
Cash from investing activities
(83,908,665)
(55,121,994)
(73,952,000)
Cash from financing activities
(7,271,206)
(49,101,039)
(62,397,000)
FCF
7,874,841
69,001,134
23,497,478
Balance
Cash
85,869,355
71,369,233
65,600,000
Long term investments
41,516,266
24,133,840
22,909,000
Excess cash
97,615,142
66,407,349
54,965,350
Stockholders' equity
187,646,747
157,358,590
176,826,327
Invested Capital
457,029,236
413,608,702
466,732,296
ROIC
7.18%
7.11%
14.29%
ROCE
6.98%
8.40%
15.12%
EV
Common stock shares outstanding
4,392,013
4,347,670
4,323,423
Price
162.00
20.00%
135.00
43.77%
93.90
-11.83%
Market cap
711,506,106
21.22%
586,935,450
44.58%
405,969,420
-12.68%
EV
815,589,212
664,741,407
538,379,907
EBITDA
98,981,597
97,459,157
135,627,478
EV/EBITDA
8.24
6.82
3.97
Interest
6,747,843
6,379,798
3,334,000
Interest/NOPBT
17.23%
15.82%
4.16%