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XNYSASX
Market cap20bUSD
Dec 20, Last price  
10.00USD
1D
0.91%
1Q
1.21%
Jan 2017
98.41%
IPO
81.16%
Name

ASE Technology Holding Co Ltd

Chart & Performance

D1W1MN
XNYS:ASX chart
P/E
44.67
P/S
2.44
EPS
7.31
Div Yield, %
87.21%
Shrs. gr., 5y
15.39%
Rev. gr., 5y
9.41%
Revenues
581.91b
-13.26%
81,598,634,30984,253,573,295100,408,141,182101,168,479,08294,431,000,00085,775,000,000188,742,797,000185,347,206,000193,972,000,000219,862,000,000256,591,000,000283,302,000,000274,884,000,000290,441,000,000371,092,000,000413,182,000,000476,978,000,000569,997,000,000670,873,000,000581,914,471,000
Net income
31.73b
-48.42%
4,203,803,343-4,703,344,24017,413,473,13712,165,887,8526,160,000,0006,744,000,00018,337,500,00013,725,958,00013,091,000,00016,296,000,00023,593,000,00019,051,000,00021,692,000,00022,988,000,00025,262,000,00017,060,591,00026,970,580,00060,150,167,00061,501,545,00031,725,403,000
CFO
114.42b
+3.10%
19,459,809,16420,503,994,81037,288,838,51428,308,294,98430,728,799,00015,517,228,00036,965,094,00031,936,706,00029,017,945,00041,295,955,00045,863,477,00057,548,305,00052,107,867,00047,430,800,00050,760,000,00072,303,000,00075,074,000,00081,686,000,000110,984,000,000114,421,849,000
Dividend
Jul 02, 20240.00994143 USD/sh
Earnings
Feb 01, 2025

Profile

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
IPO date
Apr 30, 2018
Employees
93,950
Domiciled in
TW
Incorporated in
TW

Valuation

Title
TWD in thousands, except ratios and share amounts
FYFYFYFYFYFYFYFYFYFY
2023‑122022‑122021‑122020‑122019‑122018‑122017‑122016‑122015‑122014‑12
Income
Revenues
581,914,471
-13.26%
670,873,000
17.70%
569,997,000
19.50%
Cost of revenue
541,586,764
590,697,522
507,871,795
Unusual Expense (Income)
NOPBT
40,327,707
80,175,478
62,125,205
NOPBT Margin
6.93%
11.95%
10.90%
Operating Taxes
9,042,952
16,399,000
14,322,000
Tax Rate
22.42%
20.45%
23.05%
NOPAT
31,284,755
63,776,478
47,803,205
Net income
31,725,403
-48.42%
61,501,545
2.25%
60,150,167
123.02%
Dividends
(37,840,609)
(29,990,842)
(18,082,500)
Dividend yield
6.45%
7.39%
3.89%
Proceeds from repurchase of equity
1,175,260
863,647
204,424,244
BB yield
-0.20%
-0.21%
-43.97%
Debt
Debt current
35,789,095
56,772,000
55,466,000
Long-term debt
117,235,655
145,507,487
171,710,884
Deferred revenue
(7,590,197)
Other long-term liabilities
17,103,586
18,497,868
23,062,000
Net debt
57,521,677
113,770,487
124,768,884
Cash flow
Cash from operating activities
114,421,849
110,984,000
81,686,000
CAPEX
(54,158,229)
(71,890,000)
(69,301,000)
Cash from investing activities
(55,121,994)
(73,952,000)
(49,091,000)
Cash from financing activities
(49,101,039)
(62,397,000)
(5,814,000)
FCF
69,001,134
23,497,478
22,781,205
Balance
Cash
71,369,233
65,600,000
79,148,000
Long term investments
24,133,840
22,909,000
23,260,000
Excess cash
66,407,349
54,965,350
73,908,150
Stockholders' equity
157,358,590
176,826,327
144,224,282
Invested Capital
413,608,702
466,732,296
425,928,914
ROIC
7.11%
14.29%
11.62%
ROCE
8.40%
15.12%
12.24%
EV
Common stock shares outstanding
4,347,670
4,323,423
4,365,668
Price
135.00
43.77%
93.90
-11.83%
106.50
31.00%
Market cap
586,935,450
44.58%
405,969,420
-12.68%
464,943,642
33.35%
EV
664,741,407
538,379,907
604,268,526
EBITDA
97,459,157
135,627,478
116,649,205
EV/EBITDA
6.82
3.97
5.18
Interest
6,379,798
3,334,000
2,257,000
Interest/NOPBT
15.82%
4.16%
3.63%