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XNAS
AEHR
Market cap2.84bUSD
Oct 08, Last price  
87.21USD
1D
-2.42%
1Q
20.12%
Jan 2017
3,518.67%
Name

Aehr Test Systems

Chart & performance

D1W1MN
XNAS:AEHR chart
P/E
—
P/S
56.90
EPS
—
Div yield, %
—
Shrs. gr., 5y
2.00%
Rev. gr., 5y
-0.33%
Revenues
50m
-15.21%
21,407,00011,674,00013,737,00015,521,00016,488,00019,684,00010,018,00014,501,00014,501,00018,898,00029,555,00021,056,00022,291,00016,600,00050,829,00064,961,00066,218,00058,968,00058,968,00050,001,000
Net income
-7m
L+82.25%
-29,971,000-481,000-3,373,000-3,389,000-3,419,000422,000-6,647,000-6,785,000-6,785,000-5,653,000528,000-5,235,000-2,802,000-2,027,0009,450,00014,557,00033,156,000-3,910,000-3,910,000-7,126,000
CFO
-3m
L-55.27%
-11,036,0003,247,000-4,142,000-4,875,000-310,000-607,000-2,256,000-6,281,000-4,495,000-1,351,000-5,637,000-2,024,000-2,701,0001,508,00010,011,0001,756,0001,756,000-7,400,000-7,400,000-3,310,000

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Profile

Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.

Key people

Adil Engineer
Chief Operating Officer · since 2022
Chief Financial Officer, Executive Vice President - Finance · since 2023
Alberto Salamone
Executive Vice President - Packaged Parts Burn-in Business · since 2024
Didier Wimmers
Executive Vice President - Research and Development · since 2025
Donald Richmond
Chief Technology Officer · since 2023
Alistair Sporck
Vice President - Contactor Business Unit · since 2022
Vernon Rogers
Executive Vice President - Sales and Marketing · since 2018
Gayn Erickson
President, Chief Executive Officer, Director · since 2012
Fariba Danesh
Independent Director · since 2021
William Elder
Independent Director · since 1989
Laura Oliphant
Independent Director · since 2019
Rhea Posedel
Non-Executive Independent Chairman of the Board, Founder · since 2022
Geoffrey Scott
Independent Director · since 2020
Howard Slayen
Independent Director · since 2008
IPO date
Aug 15, 1997
Employees
91
Domiciled in
US
Incorporated in
US
Headquarters & legal address
400 Kato Terrace
Fremont, CA 94539
US

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