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XJPX
4971
Market cap623mUSD
Dec 05, Last price  
5,300.00JPY
1D
1.92%
1Q
72.08%
Jan 2017
447.52%
IPO
2,653.25%
Name

MEC Co Ltd

Chart & Performance

D1W1MN
XJPX:4971 chart
P/E
42.23
P/S
5.31
EPS
125.49
Div Yield, %
0.85%
Shrs. gr., 5y
-0.27%
Rev. gr., 5y
10.91%
Revenues
18.23b
+30.06%
9,115,964,0006,954,549,0006,098,088,0007,049,791,0006,286,918,0006,703,970,0008,003,384,0009,057,322,0009,078,197,0009,259,839,00012,855,678,52711,328,766,00010,865,978,00011,956,625,00015,038,440,00016,329,105,00014,020,085,00018,234,377,000
Net income
2.29b
-0.58%
1,426,461,000287,887,000713,857,000136,571,00058,976,000626,956,000925,102,0001,344,329,0001,514,709,0001,642,538,0002,090,152,1081,778,214,0001,236,410,0001,595,919,0002,949,459,0003,064,520,0002,304,947,0002,291,615,000
CFO
4.20b
+116.35%
1,566,989,0001,104,902,000928,555,000988,857,000767,357,000352,635,0001,759,649,0001,489,731,0001,796,874,0001,633,405,0001,591,567,0001,928,626,0002,162,110,0002,429,714,0003,013,519,0003,810,979,0001,941,318,0004,200,122,000
Dividend
Dec 29, 202530 JPY/sh

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Profile

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.
URL
https://www.mec-co.com/
IPO date
Apr 07, 2003
Employees
438
Domiciled in
JP
Incorporated in
JP

Valuation

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2024‑122023‑122022‑122021‑122020‑122019‑122018‑122017‑122017‑032016‑03
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