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ROCO
8064
Market cap708mUSD
Jul 09, Last price  
138.00TWD
1D
9.96%
1Q
77.38%
Jan 2017
741.46%
IPO
340.75%
Name

Contrel Technology Co Ltd

Chart & Performance

D1W1MN
ROCO:8064 chart
P/E
101.19
P/S
7.92
EPS
1.36
Div Yield, %
0.43%
Shrs. gr., 5y
3.45%
Rev. gr., 5y
-5.49%
Revenues
2.87b
+10.25%
5,780,564,0003,806,879,0004,532,187,0003,920,549,0002,990,451,0002,603,886,0002,870,684,000
Net income
225m
+72.24%
213,698,00036,378,000349,650,000335,695,000158,422,000130,501,000224,775,000
CFO
652m
-4.17%
1,020,474,000-76,472,0002,377,525,000-91,580,000230,767,000680,753,000652,335,000
Dividend
Jul 03, 20250.6 TWD/sh

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Profile

Contrel Technology Co., Ltd. researches, develops, manufactures, and sells LCD equipment in Taiwan and China. The company offers mini LED test, repair, laser drilling, tile laminating equipment, collage equipment, mass transfer, laser trimming, and metal repair; sealant ultraviolent, nano protusion, photo alignment ultraviolet, ultrasonic dry cleaning equipment; macro and exterior inspection, burr check, electric test, PAD inspection, light on test, and demura inspection; pack/unpack, RTP/RTS and TFT/CF/LCD factory conveyance. It also provides semiconductor automation solutions, such as EFEM system, laser marking process automation, molding lifter, over and plasma process automation, SMT lifter, I-Box automatic inspection system, OHCV and OHRGV automated handling, shuttle, OHS, foup stocker, magazine and mini stocker, N2 wafer stocker, tray stocker, and vertical carousel; driver IC six side inspection equipment, 3D Camera, AI FVI high-speed inspection machine, AI OCR system, die bonding inspection measurement system, high precision defect inspection machine, and PLP RDL OM automatic optical measuring machine; cluster sputter system, plasma etching equipment, high precision defect inspection machine, PLP RDL OM automatic optical measuring machine, semiconductor glass laser cutting, IC bonding equipment, TGV laser modification equipment, PLP RDL 3D measuring machine, plasma cleaning equipment, and semiconductor laser debond and TRM; and semiconductor laser TRM, circuit repair, glass laser cutter, and laser debond, as well as parts laser clean. In addition, it offers TFT Array and circuit repair, laser shorting ring cut, bright point repair system, LCD cell repair, glass laser cutting, and TGV laser modification equipment; and microwave plasma desmear and horizontal continuous metal sputtering equipment, plasma clean, e-beam evaporator, optical sputter, and in line sputter system. The company was founded in 1987 and is headquartered in Tainan City, Taiwan.
IPO date
Jan 27, 2003
Employees
Domiciled in
TW
Incorporated in
TW

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