ROCO
5297
Market cap22mUSD
Nov 12, Last price
29.50TWD
Name
3S Silicon Tech Inc
Chart & Performance
P/E
16.23
P/S
2.13
EPS
1.82
Div Yield, %
2.03%
Shrs. gr., 5y
5.43%
Rev. gr., 5y
7.54%
Revenues
325m
+1.74%
Net income
43m
+80.14%
CFO
90m
+207.25%
Dividend
Aug 05, 20240.6 TWD/sh
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Profile
3s Silicon Tech., Inc. provides die bonding in discrete power devices in Taiwan and internationally. It offers clip die bonder for power devices, such as clip die bonder, clip attach, and pick and place; snap ovens, including normal snap oven, snap oven with vacuum reflow process, formic acid reflow oven, power module assembly automation solution, and flux eutectic reflow oven; customized equipment comprising power device assembly automation solution and power discrete assembly automation solutions; and open lab platform, such as product and fabrication process verification. The company was founded in 1998 and is based in Hsinchu, Taiwan.
Valuation
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