ROCO
3372
Market cap93mUSD
Oct 08, Last price
16.40TWD
1D
-1.20%
1Q
-17.17%
Jan 2017
-6.87%
IPO
-60.06%
Name
Taiwan IC Packaging Corp
Chart & performance
P/E
—
P/S
2.73
EPS
—
Div yield, %
—
Shrs. gr., 5y
0.37%
Rev. gr., 5y
-1.91%
Revenues
1.10b
+21.56%
Net income
-214m
L+15.27%
CFO
-85m
L
Dividend
Sep 07, 20230.5002 TWD/sh
Notes
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Profile
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Key people
Jingmei Guo
Chief Financial Officer, Head of Finance & Accounting, Corporate Governance Officer · since 2023
Zhongjing Chen
Head of Factory · since 2017
Lung-Te Kuo
Director · since 2019
Chairman of the Board · since 2014
Director · since 2013
Guande Wu
Director · since 2025
Zhong-He Zeng
General Manager, Director · since 2017
Yingda Liang
Independent Director · since 2025
Jian-Zhong Liu
Independent Director · since 2024
Zhen-yi Peng
Independent Director · since 2025
Valuation
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