ROCO
3372
Market cap110mUSD
Nov 12, Last price
19.70TWD
Name
Taiwan IC Packaging Corp
Chart & Performance
P/E
—
P/S
3.82
EPS
—
Div Yield, %
—
Shrs. gr., 5y
0.31%
Rev. gr., 5y
-5.21%
Revenues
904m
+4.93%
Net income
-185m
L+4.74%
CFO
87m
-2.59%
Dividend
Sep 07, 20230.5002 TWD/sh
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Profile
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
Valuation
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