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OTCM
INZRF
Market cap7.13bUSD
, Last price  
Name

Inari Amertron Bhd

Chart & Performance

D1W1MN
OTCM:INZRF chart
P/E
P/S
EPS
0.06
Div Yield, %
Shrs. gr., 5y
3.22%
Rev. gr., 5y
5.04%
Revenues
1.35b
-8.58%
100,232,000123,357,000154,800,0000180,774,728241,139,894793,655,000933,099,0001,043,120,0001,176,672,0001,376,042,0001,152,860,0001,057,449,0001,428,704,0001,547,899,0001,354,003,0001,478,749,0001,351,937,000
Net income
219m
-27.13%
7,885,00011,458,00015,151,000019,887,12442,013,66699,220,000152,535,000148,254,000227,761,000249,266,000191,723,000155,750,000330,473,000390,917,000323,535,000300,193,000218,745,000
CFO
322m
-37.57%
18,216,95870,593,77740,550,000173,503,000170,380,000304,358,000277,804,000270,492,000347,010,000486,522,000504,675,000418,980,000515,469,000321,799,000

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Profile

Inari Amertron Berhad, established in Petaling Jaya, Malaysia in 2006, operates as an investment holding company with a core focus on providing electronic manufacturing services (EMS) and outsourced semiconductor assembly and testing (OSAT). The company’s international reach spans Malaysia, Singapore, the United States, China, and the Philippines. Specializing in radio frequency (RF), fiber-optic transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies, Inari offers a wide array of services. These include advanced wafer processing, such as bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. For fiber optic chips, it provides fabrication and certification, encompassing wafer scribe and cleave, bar alignment, demount-load fixtures, facet coating, and chip-on-carrier solutions. The company also excels in sophisticated system-in-package (SiP) assembly and testing. This involves fine-pitch surface mount technology (SMT), high-speed and high-accuracy flip-chip placement, in-line post-vision, molding underfill, post-mold oxide plating, and final testing for advanced communication chips. Additional services cover new product introduction (NPI), failure analysis, design and characterization for sensor and IC packages, process customization, product testing, box build, and direct-to-end-customer dropshipping. Furthermore, Inari Amertron manufactures electronic optical fiber and optoelectronic devices, communication chips, and prepares dies. It undertakes the manufacturing, assembly, and testing of various optoelectronic and sensor components, modules, and systems. The company also designs and develops fiber optic products, alongside designing, assembling, and supplying both standard and customized semiconductor manufacturing process tools and their parts. Its portfolio also includes property investments.
IPO date
Jul 19, 2011
Employees
Domiciled in
MY
Incorporated in
MY

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