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OTCM
INZRF
Market cap7.13bUSD
, Last price  
Name

Inari Amertron Bhd

Chart & performance

D1W1MN
OTCM:INZRF chart
P/E
P/S
EPS
0.03
Div yield, %
Shrs. gr., 5y
2.70%
Rev. gr., 5y
-3.63%
Revenues
1.19b
-12.18%
100,232,000123,357,000154,800,0000180,774,728241,139,894793,655,000933,099,0001,043,120,0001,176,672,0001,376,042,0001,152,860,0001,057,449,0001,428,704,0001,547,899,0001,354,003,0001,478,749,0001,351,937,0001,187,254,000
Net income
127m
-41.71%
7,885,00011,458,00015,151,000019,887,12442,013,66699,220,000152,535,000148,254,000227,761,000249,266,000191,723,000155,750,000330,473,000390,917,000323,535,000300,193,000218,745,000127,497,000
CFO
321m
-0.36%
18,216,95870,593,77740,550,000173,503,000170,380,000304,358,000277,804,000270,492,000347,010,000486,522,000504,675,000418,980,000515,469,000321,799,000320,630,000

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Profile

Inari Amertron Berhad, established in Petaling Jaya, Malaysia in 2006, operates as an investment holding company with a core focus on providing electronic manufacturing services (EMS) and outsourced semiconductor assembly and testing (OSAT). The company’s international reach spans Malaysia, Singapore, the United States, China, and the Philippines. Specializing in radio frequency (RF), fiber-optic transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies, Inari offers a wide array of services. These include advanced wafer processing, such as bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. For fiber optic chips, it provides fabrication and certification, encompassing wafer scribe and cleave, bar alignment, demount-load fixtures, facet coating, and chip-on-carrier solutions. The company also excels in sophisticated system-in-package (SiP) assembly and testing. This involves fine-pitch surface mount technology (SMT), high-speed and high-accuracy flip-chip placement, in-line post-vision, molding underfill, post-mold oxide plating, and final testing for advanced communication chips. Additional services cover new product introduction (NPI), failure analysis, design and characterization for sensor and IC packages, process customization, product testing, box build, and direct-to-end-customer dropshipping. Furthermore, Inari Amertron manufactures electronic optical fiber and optoelectronic devices, communication chips, and prepares dies. It undertakes the manufacturing, assembly, and testing of various optoelectronic and sensor components, modules, and systems. The company also designs and develops fiber optic products, alongside designing, assembling, and supplying both standard and customized semiconductor manufacturing process tools and their parts. Its portfolio also includes property investments.

Key people

Independent Non-Executive Chairman of the Board · since 2010
Kean Cheong Lau
Group Chief Executive Officer, Executive Director · since 2012
Poh Leng Chong
Group Chief Financial Officer · since 2015
Sabran Bin Samsuri
Chief Operating Officer Of Inari Technology · since 2013
Kai Eng Chee
Senior Vice President of Amertron Incorporated, Philippines · since 2014
Fook Tuck Cheang
Vice President of Inari Technology Sdn Bhd · since 2018
Chee Wah Lim
Vice President - Facility, Inari Technology Sdn Bhd · since 2018
Che Azib Noorazidi
Deputy Vice-President Operation Technology Strategic Programs, Inari Technology Sdn Bhd · since 2018
Liew Seng Toh
Vice President - Inari Integrated System
Ooi Lin Cheng
Vice President Group Business Development, Research & Development and Inari Semiconductor Labs Sdn. Bhd · since 2018
Boon Shin Ooi
Senior General Manager Finance, Inari Technology Sdn Bhd · since 2018
Executive Director · since 2013
Company Secretary · since 2011
Joint Company Secretary · since 2014
Executive Vice Chairman of the Board · since 2012
Non-Independent Non-Executive Director · since 2010
Independent Non-Executive Director · since 2011
Independent Non-Executive Director · since 2010
Non-Executive Independent Director · since 2018
IPO date
Jul 19, 2011
Employees
Domiciled in
MY
Incorporated in
MY

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