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OTCM
ASMVF
Market cap7.11bUSD
, Last price  
Name

ASMPT Ltd

Chart & performance

D1W1MN
OTCM:ASMVF chart
P/E
—
P/S
—
EPS
2.15
Vol. 1Y
—
Shs. 5Y
0.35%
Rev. 5Y
-1.35%
Div Yld LY
—
Div Yld TTM
—
Revenues
13.74b
+3.83%
4,555,953,0005,392,661,0005,258,413,0004,732,174,0009,515,089,00012,915,194,00010,460,558,00010,841,166,00014,229,177,00012,977,289,00014,249,093,00017,522,713,00019,550,590,00015,883,042,00014,700,250,00021,947,637,00019,363,495,00014,697,489,00013,229,079,00013,736,243,000
Net income
902m
+161.26%
1,149,477,0001,269,497,000973,673,000935,438,0002,842,034,0002,931,980,000688,994,000558,589,0001,599,954,000956,191,0001,463,864,0002,815,473,0002,216,062,000619,249,0001,621,516,0003,168,976,0002,620,251,000715,353,000345,262,000902,034,000
CFO
243m
-76.23%
1,417,088,0001,164,571,0001,403,098,000951,815,0002,767,980,0001,696,243,000476,270,000924,093,0001,485,065,0001,186,376,0001,957,598,0001,621,085,0001,942,339,0002,833,682,0002,676,991,0002,542,771,0002,942,507,0002,347,978,0001,020,125,000242,516,000
Dividend
Aug 11, 20260.12362 /sh

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Profile

ASMPT Limited, an investment holding entity, specializes in the global development, production, and distribution of machinery, instruments, and consumables utilized within the semiconductor and electronics assembly sectors. Its operations are divided into two primary segments: Semiconductor Solutions and Surface Mount Technology Solutions. The company's diverse product portfolio encompasses equipment for deposition processes, wafer separation, AOI/FOL, die attachment, wire bonding, dispensing, encapsulation, and CIS. It also provides systems for singulation, trimming, forming, LED testing, sorting, taping, sintering, and final testing and handling. Furthermore, ASMPT delivers a range of surface mount and advanced packaging technologies, alongside solutions for encapsulation, MEMs, power management, LED/optoelectronics, photonics, COB, stacked die configurations, and intelligent SMT factory automation, including applications for image sensors. Ancillary services include agency and logistics. Established in 1975 and headquartered in Tsing Yi, Hong Kong, the company was previously known as ASM Pacific Technology Limited until its renaming in June 2022.

Related entities

Subsidiaries (2)
ASMPT SINGAPORE PTE. LTD.
ASMPT GmbH & Co. KG

Key people

Josef Ernst
Senior Vice President, Chief Executive Officer - SMT Solutions Segment · since 2024
Choon Khoon Lim
Senior Vice President, Chief Executive Officer of the Semiconductor Solutions Advanced Packaging · since 2024
Tson Cheong Poh
Senior Vice President, Chief Executive Officer of the Semiconductor Solutions Mainstream · since 2024
Gim Wee Pua
Chief People Officer, Senior Vice President
Yifan Xu
Chief Financial Officer, Senior Vice President
Choon Kong
Vice President, General Counsel, Company Secretary · since 2024
Guenter Lauber
Executive Director, Executive Vice President, Chief Strategy Officer and Chief Digitalisation Officer and Chief Executive Officer of the Group's SMT Solutions Segment · since 2021
Cher Tat Ng
Chief Executive Officer, Executive Director · since 2020
Paulus Antonius Henricus Verhagen
Non-Executive Director · since 2021
Hichem M'Saad
Non-Executive Director · since 2024
Kam Chong Lok
Independent Non-Executive Chairman of the Board · since 2025
Non-Executive Independent Director · since 2022
Meng Meng Koh
Non-Executive Independent Director · since 2025
Non-Executive Independent Director · since 2022
IPO date
Jan 03, 1989
Employees
11,300
Domiciled in
HK
Incorporated in
KY
Legal address
C/O JTC (Cayman) Limited
60 Nexus Way
6th Floor, P O Box 30745
Grand Cayman
Camana Bay KY1-1203
KY
Headquarters
19/F, Gateway Ts
8 Cheung Fai Road
Tsing Yi
Hong Kong 999077
HK
Previous name
ASM PACIFIC TECHNOLOGY LIMITED

Valuation

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