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XSHG603005
Market cap2.65bUSD
Dec 25, Last price  
29.67CNY
1D
0.10%
1Q
57.15%
Jan 2017
69.45%
IPO
67.72%
Name

China Wafer Level CSP Co Ltd

Chart & Performance

D1W1MN
XSHG:603005 chart
P/E
128.92
P/S
21.19
EPS
0.23
Div Yield, %
0.24%
Shrs. gr., 5y
10.64%
Rev. gr., 5y
10.03%
Revenues
913m
-17.43%
138,848,800270,679,985306,119,890337,332,771450,433,205615,810,322575,718,355512,390,368628,779,607566,233,702560,367,3541,103,528,7571,411,173,8571,106,070,998913,288,878
Net income
150m
-34.30%
50,907,20090,742,369114,683,450137,911,768153,732,160196,310,877113,275,30352,753,27195,691,73671,124,803108,304,952381,616,747576,045,056228,443,950150,095,690
CFO
306m
-22.00%
76,933,800121,418,643144,334,627147,500,362203,819,606239,583,810206,656,321110,533,010234,538,003292,157,470133,527,705483,912,740613,101,286391,750,297305,581,900
Dividend
May 24, 20240.046 CNY/sh
Earnings
May 09, 2025

Profile

China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
URL
http://www.wlcsp.com/
IPO date
Feb 10, 2014
Employees
Domiciled in
CN
Incorporated in
CN

Valuation

Title
CNY in thousands, except ratios and share amounts
FYFYFYFYFYFYFYFYFYFY
2023‑122022‑122021‑122020‑122019‑122018‑122017‑122016‑122015‑122014‑12
Income
Revenues
913,289
-17.43%
1,106,071
-21.62%
1,411,174
27.88%
Cost of revenue
727,621
841,903
884,208
Unusual Expense (Income)
NOPBT
185,668
264,168
526,966
NOPBT Margin
20.33%
23.88%
37.34%
Operating Taxes
4,850
8,786
60,093
Tax Rate
2.61%
3.33%
11.40%
NOPAT
180,818
255,383
466,874
Net income
150,096
-34.30%
228,444
-60.34%
576,045
50.95%
Dividends
(45,675)
(115,364)
(79,746)
Dividend yield
0.32%
0.96%
0.29%
Proceeds from repurchase of equity
(8,426)
BB yield
0.06%
Debt
Debt current
207,668
114,413
9,094
Long-term debt
168,965
73,687
82,220
Deferred revenue
74,970
92,229
113,351
Other long-term liabilities
839
598
3,060
Net debt
(2,565,881)
(2,522,289)
(2,348,605)
Cash flow
Cash from operating activities
305,582
391,750
613,101
CAPEX
(210,724)
Cash from investing activities
(1,516,737)
Cash from financing activities
125,357
3,468
11,266
FCF
163,536
315,781
2,589
Balance
Cash
2,554,606
2,294,241
2,273,482
Long term investments
387,908
416,149
166,437
Excess cash
2,896,849
2,655,086
2,369,360
Stockholders' equity
2,164,362
2,313,508
2,119,045
Invested Capital
2,375,482
1,941,869
1,969,418
ROIC
8.38%
13.06%
23.96%
ROCE
4.09%
6.19%
12.86%
EV
Common stock shares outstanding
652,590
651,001
651,772
Price
21.96
18.38%
18.55
-56.23%
42.38
-5.84%
Market cap
14,330,875
18.67%
12,076,065
-56.28%
27,622,112
47.21%
EV
11,797,785
9,588,214
25,366,966
EBITDA
360,029
425,786
671,012
EV/EBITDA
32.77
22.52
37.80
Interest
10,313
2,037
Interest/NOPBT
5.55%
0.77%