XSHE
002185
Market cap7.73bUSD
Oct 09, Last price
15.85CNY
1D
-1.12%
1Q
-37.38%
Jan 2017
193.52%
IPO
627.06%
Name
Tianshui Huatian Technology Co.
Chart & performance
P/E
72.02
P/S
2.97
EPS
0.22
Div yield, %
0.36%
Shrs. gr., 5y
3.11%
Rev. gr., 5y
7.31%
Revenues
17.21b
+19.03%
Net income
711m
+15.30%
CFO
3.47b
+12.08%
Dividend
Jun 10, 20260.022 CNY/sh
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Profile
Tianshui Huatian Technology Co., Ltd., together with its subsidiaries, engages in research, development, production, packaging, testing, and sales of semiconductor integrated circuits in China and internationally. It offers integrated circuit packaging products, including multiple series such as DIP, SOT, SOP, QFP, QFN/DFN, BGA/LGA, FC, MCM, SiP, WLP, TSV, Bumping, MEMS, FO, PLP, and 2.5D/3D. It is used in electronic assemblies and intelligent fields, such as computers, network communications, consumer electronics and smart mobile terminals, the Internet of Things, industrial automation control, and automotive electronics. The company is also involved in engineering and electromechanical; import and export trade; and investment activities. It exports its products. Tianshui Huatian Technology Co., Ltd. was founded in 2003 and is headquartered in Tianshui, China.
Key people
Yong Song
Chief Financial Officer
Liujun Li
General Manager, Director · since 2013
Wenying Chang
Deputy General Manager, Secretary of the Board
Jianjun Chen
Director · since 2012
Jian Jun Liu
Director · since 2010
Shengli Xiao
Chairman of the Board · since 2012
Yongshou Zhou
Executive Deputy General Manager, Director · since 2010
Keyun Bi
Independent Director · since 2013
Jingdao Li
Independent Director · since 2013
Valuation
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