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XJPX
2962
Market cap67mUSD
Jul 10, Last price  
1,280.00JPY
1D
2.56%
1Q
44.80%
IPO
51.12%
Name

Tecnisco Ltd

Chart & Performance

D1W1MN
XJPX:2962 chart
P/E
P/S
3.35
EPS
Div Yield, %
Shrs. gr., 5y
Rev. gr., 5y
%
Revenues
3.36b
-28.21%
4,346,629,0005,480,794,0005,347,037,0004,683,182,0003,362,209,000
Net income
-2.98b
L+393.15%
277,328,000802,787,000222,341,000-603,632,000-2,976,832,000
CFO
-257m
L-33.59%
837,108,0001,042,504,000361,148,000-386,636,000-256,771,000

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Profile

Established in 1970 and headquartered in Tokyo, Japan, Tecnisco, Ltd. is a precision component manufacturer and supplier serving the optoelectronics, electronics, and life science industries within Japan. The company offers a comprehensive array of heatsink solutions, encompassing micro channel coolers, CuW sub mounts, insulated Cu-AlN-Cu sub mounts, and high-pressure seamless micro channels, along with essential mounts and carriers. These are crucial for diverse applications such as optical communication, industrial lasers, power semiconductor devices, and microprocessing units (MPUs). Beyond heatsinks, Tecnisco provides an extensive selection of specialized glass products. These include micro-hole glass, through-glass vias, cavity and cap glass, mesh glass, spacer glass, and microfluidic glass, which find utility in projectors, sensors, mobile devices, semiconductors, biotechnology, and medical equipment. Additionally, their silicon product line features CVD susceptors, a variety of rings for equipment (e.g., focus rings, cleaning jigs), wall plates for implantation domes, tubes, pins, and optical waveguide wafer jigs, catering to numerous devices, tables, and nozzles. The company further supplies silicon wafers for dicing tests and various drilling tools. Tecnisco, Ltd. operates as a subsidiary of Disco Corporation.
IPO date
Jul 26, 2023
Employees
Domiciled in
JP
Incorporated in
JP

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2025‑062024‑062023‑062022‑062021‑06
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