Loading...
XNASIMOS
Market cap669mUSD
Jan 17, Last price  
18.24USD
1D
0.33%
1Q
-18.97%
Jan 2017
17.75%
IPO
18.75%
Name

ChipMOS Technologies Inc

Chart & Performance

D1W1MN
XNAS:IMOS chart
P/E
219.98
P/S
20.27
EPS
2.71
Div Yield, %
6.09%
Shrs. gr., 5y
-2.02%
Rev. gr., 5y
2.94%
Revenues
21.36b
-9.19%
18,210,936,00019,220,560,00019,361,930,00022,005,131,00019,869,391,00018,387,593,00017,940,855,00018,480,027,00020,337,900,00023,011,381,00027,400,035,00023,517,064,00021,356,228,000
Net income
1.97b
-42.80%
361,891,0001,119,395,0002,323,254,0003,318,633,0002,230,469,0001,707,222,0003,026,528,0001,103,075,0002,584,200,0002,378,978,0004,937,267,0003,439,697,0001,967,565,000
CFO
6.48b
-24.77%
5,867,710,0004,949,104,0005,762,535,0005,842,286,0005,565,591,0003,548,687,0004,753,227,0004,129,333,000200,400,0005,940,236,0007,319,709,0008,616,433,0006,482,387,000
Dividend
Jun 27, 20241.11166 USD/sh
Earnings
Feb 22, 2025

Profile

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.
IPO date
Apr 19, 2013
Employees
5,688
Domiciled in
TW
Incorporated in
TW

Valuation

Title
TWD in thousands, except ratios and share amounts
FYFYFYFYFYFYFYFYFY
2023‑122022‑122021‑122020‑122019‑122018‑122017‑122016‑122015‑12
Income
Revenues
21,356,228
-9.19%
23,517,064
-14.17%
Cost of revenue
19,533,719
20,430,318
Unusual Expense (Income)
NOPBT
1,822,509
3,086,746
NOPBT Margin
8.53%
13.13%
Operating Taxes
374,798
588,175
Tax Rate
20.56%
19.05%
NOPAT
1,447,711
2,498,571
Net income
1,967,565
-42.80%
3,439,697
-30.33%
Dividends
(1,672,652)
(3,127,133)
Dividend yield
5.39%
12.57%
Proceeds from repurchase of equity
BB yield
Debt
Debt current
2,515,870
1,684,004
Long-term debt
14,527,135
14,124,733
Deferred revenue
120,963
127,657
Other long-term liabilities
248,572
280,815
Net debt
4,156,899
993,628
Cash flow
Cash from operating activities
6,482,387
8,616,433
CAPEX
(3,073,881)
(4,699,369)
Cash from investing activities
(3,090,177)
(5,061,924)
Cash from financing activities
(1,059,094)
416,894
FCF
(2,818,154)
3,185,584
Balance
Cash
12,437,836
10,123,559
Long term investments
448,270
4,691,550
Excess cash
11,818,295
13,639,256
Stockholders' equity
18,810,169
18,355,204
Invested Capital
29,382,496
25,935,041
ROIC
5.23%
9.63%
ROCE
4.41%
7.76%
EV
Common stock shares outstanding
734,938
742,646
Price
42.25
26.12%
33.50
-31.07%
Market cap
31,051,130
24.81%
24,878,641
-31.09%
EV
35,208,030
25,872,269
EBITDA
6,601,842
7,838,648
EV/EBITDA
5.33
3.30
Interest
266,390
142,439
Interest/NOPBT
14.62%
4.61%